Design for Manufacture Analysis
Setting DFM Analysis Preferences for PADS Layout
Modifying Analysis Constraints
Creating Feature Attribute Rules
Fabrication Analysis - Drill Checks
Tests Performed in Drill Checks
Attributes Used in Drill Checks
Plated Slot Summary (Hole Size)
Duplicate Holes (Hole Separation)
Touching Holes (Hole Separation)
No Thermal (Thermal Connection)
TH Aspect Ratio (PCB Aspect Ratio)
ERF Parameters for Drill Checks
ERF Variables for Drill Checks
Fabrication Analysis - Signal Layer Checks
Tests Performed in Signal Layer Checks
Attributes Used in Signal Layer Checks
DFM Analysis Compatibility for Signal Layer Checks
Sliver and Short Sliver Categories (Signal Layer Checks)
Categories in Signal Layer Checks
PTH to Copper Same Net (Drill)
PTH (Comp) Annular Ring (Drill)
Blind Via Annular Ring (Drill)
Buried Via Annular Ring (Drill)
Tooling Hole to Exposed Copper (Drill)
Sliver (Sliver) (Signal Layer)
Short Sliver (Sliver) (Signal Layer)
Exposed Via to Exposed Via (Exposure)
Exposed Via to Exposed Copper (Exposure)
Fabrication Analysis - Power and Ground Checks
Tests Performed in Power and Ground Checks
Attributes Used in Power and Ground Checks
DFM Analysis Compatibility for Power and Ground Checks
Sliver and Short Sliver Categories (Power and Ground)
Categories in Power and Ground Checks
PTH Contains Clearance (Drill)
Via Contains Clearance (Drill)
Thermal Connect Reduction (Thermal)
Segmentation Lines (Plane Spacing)
Fabrication Analysis - Solder Mask Checks
Tests Performed in Solder Mask Checks
Attributes Used in Solder Mask Checks
DFM Analysis Compatibility for Solder Mask Checks
Sliver and Short Sliver Categories (SM)
Polarity for Solder Mask Layers
Categories in Solder Mask Checks
Missing SMD Clearance (Missing)
Missing Undrilled Pad Clearance (Missing)
Missing NPTH Clearance (Missing)
Missing PTH Clearance (Missing)
Missing Via Clearance (Missing)
Missing Testpoint Clearance (Missing)
Pad to Non-Pad Spacing (Spacing)
Extra SM - Missing Copper (Extra)
ERF Parameters for Solder Mask Checks
ERF Variables for Solder Mask Checks
Fabrication Analysis - Silk Screen Checks
Tests Performed in Silk Screen Checks
Attributes Used in Silk Screen Checks
Grouping of Silk Screen Results
Limitations in Silk Screen Checks
Categories in Silk Screen Checks
PTH Pads Clearance (Pad Clearance)
Via Pads Clearance (Pad Clearance)
NPTH Pads Clearance (Pad Clearance)
Undrilled Pads Clearance (Pad Clearance)
NPTH Clearance (Hole Clearance)
PTH Clearance (Hole Clearance)
Via Clearance (Hole Clearance)
String Line Width (String Properties)
ERF Parameters for Silk Screen Checks
ERF Variables for Silk Screen Checks
Fabrication Analysis - Board-Drill Checks
Attributes Used in Board-Drill Checks
Categories in Board-Drill Checks
ERF Parameters for Silk Screen Checks
ERF Variables for Silk Screen Checks
Assembly Analysis - Component Analysis
Tests Performed in Component Analysis
Attributes Used in Component Analysis
Classification by Process Area
Classification by Component Type
Example of User-Defined Component Type Classification
Classifying Results by a User Defined Component Attribute
Classification by Component Side
Categories in Component Analysis
Comp. Under Component (Spacing)
ERF Parameters for Component Analysis
ERF Variables for Component Analysis
Assembly Analysis - Testpoint Analysis
Tests Performed in Testpoint Analysis
Attributes Used in Testpoint Analysis
Categories in Testpoint Analysis
Testpoint to Testpoint (Spacing)
Testpoint to Exposed Copper (Spacing)
ERF Parameters for Testpoint Analysis
ERF Variables for Testpoint Analysis
Assembly Analysis - Solderpaste Analysis
Tests Performed in Solderpaste Analysis
Attributes Used in Solderpaste Analysis
Categories in Solderpaste Analysis
Non-SMD Pads with Solderpaste (SMD)
SMD Pad Without Solderpaste (SMD)
ERF Parameters for Solderpaste Analysis
ERF Variables for Solderpaste Analysis