DFM Analyses User Guide
Design for Manufacture Analysis
Category Format
Analysis Constraints
Internal Attribute Names
Fabrication Analysis
Assembly Analysis
System
Performing DFM Analysis
Setting DFM Analysis Preferences for PADS Layout
Modifying Analysis Constraints
Creating Feature Attribute Rules
Running DFM Analysis
Terminology
Fabrication Analysis - Drill Checks
Tests Performed in Drill Checks
Attributes Used in Drill Checks
Thermal Connection
PCB Aspect Ratio
Categories in Drill Checks
PTH Summary (Hole Size)
NPTH Summary
Via Summary (Hole Size)
Plated Slot Summary (Hole Size)
Tooling Holes (Hole Size)
Mounting Holes (Hole Size)
Duplicate Holes (Hole Separation)
Touching Holes (Hole Separation)
Close Holes (Hole Separation)
Missing Holes (Missing Holes)
No Thermal (Thermal Connection)
TH Aspect Ratio (PCB Aspect Ratio)
ERF Parameters for Drill Checks
ERF Variables for Drill Checks
Fabrication Analysis - Signal Layer Checks
Tests Performed in Signal Layer Checks
Attributes Used in Signal Layer Checks
DFM Analysis Compatibility for Signal Layer Checks
Annular Ring Measurement
Sliver and Short Sliver Categories (Signal Layer Checks)
Categories in Signal Layer Checks
Via to Via (Spacing)
Pad to Pad (Spacing)
Pad to Circuit (Spacing)
Circuit to Circuit (Spacing)
Text to Text (Spacing)
Text Touches Copper (Spacing)
Spacing Length (Spacing)
Same Net Spacing (Spacing)
CAD Self Spacing (Spacing)
NPTH to Pad (Drill)
NPTH to Circuit (Drill)
PTH to Copper (Drill)
PTH to Copper Same Net (Drill)
PTH Registration (Drill)
NPTH Registration (Drill)
NPTH Annular Ring (Drill)
PTH Annular Ring (Drill)
PTH (Comp) Annular Ring (Drill)
Blind Via Annular Ring (Drill)
Buried Via Annular Ring (Drill)
Via to Copper (Drill)
Tooling Hole to Exposed Copper (Drill)
Pads (Size)
Lines (Size)
Shaved Line (Size)
Text (Size)
Line Neckdown (Size)
Arc (Size)
Shaved Arc (Size)
Conductor Width (Size)
Sliver (Sliver) (Signal Layer)
Short Sliver (Sliver) (Signal Layer)
Stubs (Stubs)
SMD Pads (SMD)
Exposed Via to Exposed Via (Exposure)
Exposed Via to Exposed Copper (Exposure)
ERF Parameters
ERF Variables
Fabrication Analysis - Power and Ground Checks
Tests Performed in Power and Ground Checks
Attributes Used in Power and Ground Checks
DFM Analysis Compatibility for Power and Ground Checks
Sliver and Short Sliver Categories (Power and Ground)
Categories in Power and Ground Checks
NPTH to Copper (Drill)
PTH Annular Ring (Drill)
PTH to Copper (Drill)
Via to Copper (Drill)
PTH Contains Clearance (Drill)
Via Contains Clearance (Drill)
PTH to Plane (Drill)
Via to Plane (Drill)
NPTH to Plane (Drill)
NPTH Contains Copper (Drill)
Missing Cu for Vias (Drill)
PTH Registration (Drill)
NPTH Registration (Drill)
Via Registration (Drill)
Sliver (Sliver)
Short Sliver (Sliver)
Spoke Width (Thermal)
Thermal Connect Reduction (Thermal)
Plane Spacing (Plane Spacing)
Segmentation Lines (Plane Spacing)
ERF Parameters
ERF Variables
Fabrication Analysis - Solder Mask Checks
Tests Performed in Solder Mask Checks
Attributes Used in Solder Mask Checks
DFM Analysis Compatibility for Solder Mask Checks
Sliver and Short Sliver Categories (SM)
Polarity for Solder Mask Layers
Categories in Solder Mask Checks
PTH Annular Ring (Drill)
NPTH Annular Ring (Drill)
Via Annular Ring (Drill)
NPTH Touches Mask (Drill)
PTH Gasket (Drill)
Via Gasket (Drill)
SMD Annular Ring (Pads)
Pad Annular Ring (Pads)
PTH Pad Annular Ring (Pads)
NPTH Pad Annular Ring (Pads)
Via Pad Annular Ring (Pads)
SMD Pad Gasket (Pads)
PTH Pad Gasket (Pads)
NPTH Pad Gasket (Pads)
Via Pad Gasket (Pads)
Undrilled Pad Gasket (Pads)
Coverage (Coverage)
SM Sliver (Sliver)
SM Short Sliver (Sliver)
Missing SMD Clearance (Missing)
Missing Undrilled Pad Clearance (Missing)
Missing NPTH Clearance (Missing)
Missing PTH Clearance (Missing)
Missing Via Clearance (Missing)
Missing Testpoint Clearance (Missing)
Pad to Pad Spacing (Spacing)
Pad to Non-Pad Spacing (Spacing)
Non-Pad to Non-Pad (Spacing)
Extra SM - Missing Copper (Extra)
ERF Parameters for Solder Mask Checks
ERF Variables for Solder Mask Checks
Fabrication Analysis - Silk Screen Checks
Tests Performed in Silk Screen Checks
Attributes Used in Silk Screen Checks
Grouping of Silk Screen Results
Limitations in Silk Screen Checks
Categories in Silk Screen Checks
SM Clearance (SM Clearance)
SMD Clearance (SMD Clearance)
PTH Pads Clearance (Pad Clearance)
Via Pads Clearance (Pad Clearance)
NPTH Pads Clearance (Pad Clearance)
Undrilled Pads Clearance (Pad Clearance)
NPTH Clearance (Hole Clearance)
PTH Clearance (Hole Clearance)
Via Clearance (Hole Clearance)
Line Widths (Line Width)
String Line Width (String Properties)
ERF Parameters for Silk Screen Checks
ERF Variables for Silk Screen Checks
Fabrication Analysis - Board-Drill Checks
Attributes Used in Board-Drill Checks
Categories in Board-Drill Checks
Via to Via
Via to PTH
Via to NPTH
Via to Rout
PTH to PTH
PTH to NPTH
PTH to Rout
NPTH to NPTH
NPTH to Rout
ERF Parameters for Silk Screen Checks
ERF Variables for Silk Screen Checks
Assembly Analysis - Component Analysis
Tests Performed in Component Analysis
Attributes Used in Component Analysis
Component Outline
Dynamic Categories
Classification by Process Area
Classification by Component Type
Example of User-Defined Component Type Classification
Classifying Results by a User Defined Component Attribute
Classification by Component Side
Categories in Component Analysis
Comp. Under Component (Spacing)
Comp. Overlap (Spacing)
ERF Parameters for Component Analysis
ERF Variables for Component Analysis
Assembly Analysis - Testpoint Analysis
Tests Performed in Testpoint Analysis
Attributes Used in Testpoint Analysis
Categories in Testpoint Analysis
Testpoint to Testpoint (Spacing)
Testpoint to Exposed Copper (Spacing)
Testpoint Density (Spacing)
ERF Parameters for Testpoint Analysis
ERF Variables for Testpoint Analysis
Assembly Analysis - Solderpaste Analysis
Tests Performed in Solderpaste Analysis
Attributes Used in Solderpaste Analysis
Categories in Solderpaste Analysis
Non-SMD Pads with Solderpaste (SMD)
SMD Pad Without Solderpaste (SMD)
ERF Parameters for Solderpaste Analysis
ERF Variables for Solderpaste Analysis
DFMA Result Viewer
Result Viewer Workspace
Layer List
Result Categories Pane
Details Pane
Overview Pane
Board View of the Result
Result Viewer Tools
Grid and Snap Options
Setting Grid and Snap Options
Locations of Snap Points
Snap Hot Keys
Filtering and Reporting Results
Filtering by Layer
Filtering by Board Area
Filtering with a Histogram
Flagging Results
Creating a Results Report
Third-Party Information
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