Fabrication Analysis - Solder Mask Checks

Solder Mask Checks is a read-only check of solder mask layers for potential manufacturability defects. Its findings are collected in categories. Solder mask layers are always assumed to be negative; all positive features describe clearances or the absence of solder mask.

This action also checks if solder paste has been deposited on all SMD pads. See “Missing SMD Clearance (Missing)”.

The action operates on a single solder mask layer per side (single top, single bottom) at a time. If more than one layer is selected, the action will not analyze any layers.

This action also checks solder paste layers to detect SMDs without paste, and compares the negative annular ring (gasket) of the SMD pad with the paste pad.

This action relates to a solder mask layer, and the drill and external copper layers associated with it.

If there is no solder mask CAM document defined, PADS Layout creates a solder mask document when DFMA is opened from within PADS Layout. This newly created document includes a 10-mil oversize added to the solder mask clearance.

If there is an existing solder mask document, and it specifies the oversize, DFMA uses that value.

For an explanation of how to run this analysis, see “Performing DFM Analysis”.