Via Annular Ring (Drill)
Reports distances
less than pp_ar between vias and solder mask in negative layers.
Internal ERF Name |
<Area>:ar_via |
Measurement Shape Measurement ID |
Segment Pad (representing the via) |
Layers Displayed |
|
Graphic |
|
Purpose |
The area in and around a via should be clear of mask, enabling the solder wave to completely fill the hole around the component pin. |
Function |
Reports distances less than pp_ar between vias and solder mask in negative layers. Measurements are segments corresponding to the minimal distance between drill and clearance outline. |
ERF Parameters |
pp_ar |
ERF Variables |
|
Constraint |
Plated Hole |
Limitations |
