Hole Size — Provides a list of all PTHs, NPTHs, and vias, as well as NPTHs that need pilot drills.
Hole Separation — Reports duplicate holes, touching holes and close holes.
Missing Holes — Reports missing drills for non-SMD pads.
Thermal Connection — Reports the absence of thermals for through-hole pin drills and calculates the total copper area of thermal connections through all negative power and grand and mixed layers.
PCB Aspect Ratio — Reports the relationship between board thickness and drilled hole diameters for the smallest through hole and vias (standard, blind and buried) in the tested drill layer.