Testpoint to Testpoint (Spacing)

Reports distances between testpoints that are less than pp_t_spacing.

Analysis Category	tp2tp tp2tp;<PkgType> tp2tp;<PkgTypeA>_<PkgTypeB>
Measurement Shape Measurement IDs	Segment Two testpoint pads
Layers Displayed	Top or bottom signal layer. Corresponding solder mask layer if v_exposed_tp=1.
Graphic
Purpose	Testpoints should be kept sufficiently apart in order to allow simultaneous probing without collision.
Function	Reports distances between testpoints that are less than pp_t_spacing for these cases: None of the testpoints is a toeprint of a component (tp2tp) One of the testpoints is a toeprint of a component (tp2tp;<PkgType>) Both testpoints are toeprints of components (tp2tp;<PkgTypeA>_<PkgTypeB>) The distance is measured from pad center to pad center.
ERF Parameters
ERF Variables	v_testpoint_attr v_tp2tp_by_side = no
Constraint	Testpoint to Testpoint
Change in Behavior	When one or two of the testpoints are also toeprints of a component, the result is classified by their comp_type. Therefore, this category can be classified by two, one or no comp_type, depending upon where they are situated.
Limitations