Testpoint to Exposed Copper (Spacing)
Reports distances
between testpoints and exposed copper pads or surfaces of the outer
signal layer, less than pp_t_spacing.
Analysis Category |
<Area>:tp2c |
Measurement Shape Measurement Value Measurement IDs |
Segment Spacing Testpoint; Feature |
Layers Displayed |
Top or bottom signal layer Corresponding solder mask layer |
Graphic |
|
Purpose |
To assure testpoint probes do not touch and have sufficient clearance from exposed copper. Reports only copper pads which are neither via nor toeprint pads. |
Function |
Reports distances between testpoints and exposed copper pads or surfaces of the outer signal layer, less than pp_t_spacing. |
ERF Parameters |
pp_t_spacing |
ERF Variables |
v_exposed_tp v_tp2c_by_side = no v_ignore_tp2c_same_net v_report_same_net_spacing v_testpoint_attr |
Constraint |
Exposed Copper Spacing |
Limitations |
