Analysis Category |
<Area>:tp_density |
Measurement Shape Measurement Value Measurement Entity |
Bounding box of a group of testpoints Number of testpoints within the bounding box None |
Layers Displayed |
Signal layer |
Graphic |
|
Purpose |
Too many testpoint probes concentrated in a small area can cause pressure that could damage the board and crack solder joints. |
Function |
Reports each area that contains more than a specified number of testpoints. |
ERF Parameters |
|
ERF Variables |
v_tp_density_box_size v_tp_density_number |
Limitations |