SMD Pad Without Solderpaste (SMD)
Reports SMD
pads on the outer signal layer not covered, at least partially,
with solderpaste.
Analysis Category |
smd_without_sp;<PkgType> |
Measurement Shape Measurement Value Measurement (ID)s |
SMD pad SMD pad bounding box |
Layers Displayed |
Solderpaste layer Outer signal layer |
Graphic |
|
Purpose |
Missing solderpaste may result in broken net connectivity. |
Function |
Reports SMD pads on the outer signal layer not covered, at least partially, with solderpaste. |
ERF Parameters |
|
ERF Variables |
v_ignore_gold_smd_without_sp |
Limitations |
