Non-SMD Pads with Solderpaste (SMD)
Reports solderpaste
features touching pads without attribute SMD Pad in the outer signal
layer.
Analysis Category |
sp_non_smd;<PkgType> |
Measurement Shape Measurement Value Measurement (ID)s |
Solderpaste feature Solderpaste feature bounding box |
Layers Displayed |
Solderpaste layer Outer signal layer |
Graphic |
|
Purpose |
Solderpaste on non-SMD pads may result in shorts. |
Function |
Reports solderpaste features touching pads without attribute SMD Pad in the outer signal layer. |
ERF Parameters |
|
ERF Variables |
|
Limitations |
