No Thermal (Thermal Connection)
Reports drills
connected to a large plane (at least ten times larger than the drill)
without an interceding thermal on negative and positive Power and Ground
or mixed layers. Surfaces bearing the .tear_drop attribute are ignored.
Analysis Category |
<Area>:no_thermal;<pin_type> |
Measurement Shape Measurement Entity |
Drill shape Drill shape |
Layers Displayed |
Drill layer Copper layer |
Graphic |
|
Purpose |
Through-hole pins connected directly to a plane without a thermal may cause an improper solder joint due to heat dissipation. |
Function |
Reports drills connected to a large plane (at least ten times larger than the drill) without an interceding thermal on negative and positive Power and Ground or mixed layers. Surfaces bearing the .tear_drop attribute are ignored. |
ERF Parameters |
pp_drill_layer |
ERF Variables |
min_pad_to_report_thermal min_trace_to_report_thermal max_thermal_dist v_polarity_for_thermal_check |
Limitations |
