Internal ERF Name |
<Area>:tp_miss |
Measurement Shape Measurement Value Measurement ID |
Pad (or its bounding box) Pad size |
Layers Displayed |
|
Graphic |
|
Purpose |
Testpoint pads require solder mask clearances so that the testing probe comes in contact with the copper pad. |
Function |
Reports testpoint pads that neither include, nor are included, in any solder mask clearance. |
ERF Parameters |
|
ERF Variables |
full_tp_exposure |
Limitations |