Exposed Via to Exposed Via (Exposure)
Reports distances
less than pp_e_spacing between the edges of the exposed copper of
two uncapped vias, while ignoring pads of the same net that are fully
embedded in copper. Classified by the process.
Internal ERF Name |
<Area>:exvia2exvia |
Measurement Shape Measurement ID |
Segment Vias |
Layers Displayed |
Top or Bottom signal Solder mask layers |
Graphic |
|
Purpose |
Vias (pads) should be kept distant from each other to prevent solder bridging during the assembly process. |
Function |
Reports distances less than pp_e_spacing between the edges of the exposed copper of two uncapped vias, while ignoring pads of the same net that are fully embedded in copper. Classified by the process. |
ERF Parameters |
pp_layer pp_e_spacing |
ERF Variables |
v_tp_exvia_as_via |
Constraint |
Via Spacing |
Limitations |
