Exposed Via to Exposed Copper (Exposure)
Reports the
distance between the edge of the exposed copper of an uncapped via
and the exposed copper on the outer signal layers only, when closer than
pp_e_spacing. Does not report spacing between pads of the same net
that are fully embedded in copper. Classified by process. The reported
exposed via and exposed copper surface do not touch.
Internal ERF Name |
<Area>:exvia2exc |
Measurement Shape Measurement ID |
Segment Via and copper surface |
Layers Displayed |
Top or Bottom signal Solder mask layers |
Graphic |
|
Function |
Reports the distance between the edge of the exposed copper of an uncapped via and the exposed copper on the outer signal layers only, when closer than pp_e_spacing. Does not report spacing between pads of the same net that are fully embedded in copper. Classified by process. The reported exposed via and exposed copper surface do not touch. |
ERF Parameters |
pp_layer pp_e_spacing |
ERF Variables |
v_tp_exvia_as_via |
Constraint |
Via Spacing |
Limitations |
