Component Outline

In measuring distances between features and components, the component outline can be defined in several ways: as component body (ignoring pins), as component body and pins, or as component body and the external toeprints in a corresponding outer layer (the copper layer on the components side).

In fiducial analysis, component analysis, and testpoint analysis, where spacing to components is measured, ERF parameter Component Outline (pp_comp_outline) defines the component outline as either Body, Envelope or T‑envelope.

Diagram	Component Outline	Explanation	c2c Measurement Example
	Body	Measures the distance between a feature and component body (regardless of pins or toeprints).
	Envelope	Measures the distance between a feature and an “envelope” (a shrink-fit polygon) surrounding the component and its pins. (Default)
	T-Envelope	Measures the distance between a feature and an envelope surrounding the component and its toeprints in an outer layer.

By choosing either Envelope or T-envelope in the Controls dialog box, a dotted line will appear around the external pins or toeprints of a component, making envelope measurement more obvious. This is the recommended method for viewing spacing measurements in envelope and T-envelope mode.

Configuration parameter edt_t_envelope_mode can be used to control the T‑envelope when the solder mask is smaller than the pad.