Standard Layer Subtypes

Standard layer subtypes available in the Job Matrix for various layer types.

Subtypes to Support Backdrill and Dual Diameter Drill

These layer subtypes support the possible unique needs of drill representation in product models:

Layer Subtype	Base Layer Type	Description
BACKDRILL	DRILL	Represents a backdrill procedure where the plating within a hole is removed from the unused portion of the matrix using a drill hole slightly larger than the original. This removes the connection from one side of the PCB.
DUAL_DIAMETER	DRILL	Represents a condition prior to plating where a slightly larger hole is drilled part way through the matrix at the same location as an existing hole.

These layer subtypes support the unique needs of Flex/Rigid Flex product models:

Layer Subtype	Base Layer Type	Description
AREA	DOCUMENT	Area definition.
BEND_AREA	MASK	For labeling areas on the PCB bent when the PCB is in use.
CARBON_MASK	CONDUCTIVE_PASTE	Defines the location where carbon ink is applied to copper layers.
COVERCOAT	SOLDER_MASK	Clearances of a covercoat layer.
COVERLAY	SOLDER_MASK	Clearances of a coverlay layer.
DRAWING	DOCUMENT	Drawing layer definition
IMMERSION_MASK	MASK	Defines which features are to be covered during immersion in the gold process.
MIXED_FLEX	MIXED	Mixed copper layer—a layer containing both power/ground planes and regular signal pads or traces—on flex laminate. Used to distinguish from a Mixed copper layer on rigid laminate in a rigid-flex board.
OSP_MASK	MASK	Defines which features are to be covered with OSP finish.
PG_FLEX	POWER_GROUND	Power and ground (copper) layer on flex laminate. Used to distinguish from power and ground layer on rigid laminate in rigid-flex boards.
PLATING_MASK	MASK	Defines which features in the adjacent copper layer should be plated.
PSA	MASK	Shapes and locations where PSA (Pressure Sensitive Adhesive) material is placed on the PCB.
PUNCH	ROUT	Pattern to be punched by a die-cut fixture.
SIGNAL_FLEX	SIGNAL	Signal (copper) layer on flex laminate. Used to distinguish from signal on rigid laminate in rigid-flex boards.
SILVER_MASK	CONDUCTIVE_PASTE	Defines the silver mask of the adjacent copper layer.
STIFFENER	MASK	Shapes and locations where stiffener material is placed on the PCB.

These layer subtypes support the unique needs of product models containing embedded resistors and embedded capacitors:

Layer Subtype	Base Layer Type	Description
EMBEDDED_C	MASK	Feature shapes on the layer represent embedded capacitors.
EMBEDDED_R	MASK	Feature shapes on the layer represent embedded resistors.